Infineon Technologies: launches a new SECORA ™ Pay portfolio on 40nm technology with the best contactless performance in its category

Munich, Germany – October 20, 2021 – In recent years there has been a noticeable trend towards contactless payment. With the difficult market conditions following the COVID-19 crisis, this development is clearly accelerating. The payments market is expected to shift increasingly to contactless solutions, accounting for a global share of 76% dual interface in 2021 up to 91% over the next five years *. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has been the market leader in payment integrated circuits for eight years, with a current market share of 48% *. To complete the payment offer based on the latest 40nm technological platform, Infineon is now launching a new portfolio of SECORA â„¢ Pay payment solutions.

The plug-and-play solutions leverage the vast expertise in contactless payment technology and utilize Infineon’s SOLID FLASH chip platform, which processes new card and payment device solutions while responding to the latest requirements. The offer includes new applets and personalized value-added products for standard payment cards (SECORA Pay S), as well as multi-application cards (SECORA Pay X) and components for ready-to-use solutions that can turn any device into a payment method. (SECORA Pay W). In addition, the product portfolio provides global (Visa, MasterCard, Discover and American Express) and national network applets. It offers industry-leading contactless performance and personalization, enabling 200ms MasterCard contactless transactions.

SECORA Pay solutions on 40 nm technology offer backward compatibility with existing SECORA Pay product offerings in terms of card production for antenna design, product personalization and certification. The family uses a security controller comprising certified software embedded in Coil on Module (CoM) chip modules and refined inlays for seamless card production. Since Infineon uses inductive coupling technology in combination with on-board wired card antennas, the CoM system offers the greatest flexibility in card design. It is therefore an ideal solution to respond seamlessly to future market trends, such as environmentally friendly cards made of recycled plastic or wood and bound to the ocean, high performance dual interface metal cards or LED cards.

SECORA Pay solutions support the highest throughput in card production with minimal consumables for the manufacture of very robust dual interface cards. As a result, contactless payment technology itself becomes resource efficient. In addition, new value-added services based on the NFC tag functionality of SECORA Pay are also offered, thus enabling additional use cases such as the initial activation of the card.

The SECORA Pay W pre-certified with SPA2.1, a very small 35mm film strip antenna, meets the growing demand for payment accessories and new payment form factors. The turnkey solution, combined with the payment and tokenization services provided by the partners, allows the payment functionality to be easily integrated into the end customer’s applications. It enables convenient contactless payment features for wearable devices such as wristbands, key chains or other form factors.


Product versions supporting the latest Visa and MasterCard applications are available now. Additionally, applets supporting American Express, Discover and others will be available in the first quarter of 2021. More information is available at

* ABI research: ABI Payment and Banking Cards Secure IC Technologies, Q3 2021

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